Capabilities

Everything between the idea and the assembly line.

Most firms hand you a slice of the problem. We cover the full stack — system design, PCB, firmware, RF, and manufacturing handoff — with AI tooling multiplying every phase.

01

Embedded Systems Design

The decisions made in the first two weeks of a hardware project determine its cost, schedule, and failure modes for years. We treat system design as the highest-leverage phase of the entire program.

  • Product architecture and block-diagram-level design
  • MCU and SoC selection grounded in supply-chain reality
  • Sensor strategy, signal chains, and analog front ends
  • Power architecture, battery sizing, and sleep-current budgets
  • Certification strategy (FCC, CE, IC) planned from day one

What you get

  • System architecture
  • Component selection & BOM
  • Power budget
  • Risk register
02

PCB Design & Layout

A board that works on the bench and a board that ships at volume are two different boards. We design for the second one the first time — signal integrity, EMC, thermal, and manufacturability are layout inputs, not afterthoughts.

  • Schematic capture with structured, reviewable design files
  • Multi-layer and high-density layouts, including fine-pitch BGA
  • RF-aware routing for BLE, GNSS, LoRa, and cellular sections
  • Power integrity and EMC-driven stack-up design
  • DFM and DFT reviews against your manufacturer's capabilities

What you get

  • Schematics
  • Layout & fab files
  • Assembly drawings
  • DFM report
03

Firmware Development

Firmware is where products live or die in the field. We write firmware that is observable, updatable, and honest about failure — because a device you can't debug remotely is a warranty claim waiting to happen.

  • Bare-metal and RTOS-based development (Zephyr, FreeRTOS)
  • Wireless stacks: BLE, LoRa, LTE-M, Wi-Fi provisioning
  • Bootloaders, secure OTA update pipelines, and rollback
  • Driver development for sensors, power, and peripherals
  • Power profiling and battery-life optimization

What you get

  • Production firmware
  • OTA pipeline
  • Test suites
  • Technical documentation
04

AI-Accelerated Engineering

This is the core of how we work, not a feature we bolt on. AI tooling reviews every schematic, explores trade spaces too large for manual analysis, and generates test coverage humans skip. The result is the throughput of a department with the focus of one accountable engineer.

  • AI-assisted schematic and layout review on every revision
  • Automated trade studies across components and architectures
  • Datasheet ingestion and cross-checking at scale
  • Generated test plans, edge-case analysis, and verification code
  • Custom internal tooling built per-project when it pays for itself

What you get

  • Design review reports
  • Trade-study analysis
  • Verification artifacts
  • Project tooling
05

Wireless & IoT Integration

Radios are where schedules go to die. Antenna placement, matching networks, coexistence, and certification all interact — we handle the radio as a system, from the antenna feed to the cloud dashboard.

  • BLE, LoRa, LTE-M/NB-IoT, Wi-Fi, and GNSS integration
  • Antenna selection, placement studies, and matching
  • RF layout review and pre-certification test planning
  • Device provisioning, fleet management, and telemetry
  • Cloud ingestion pipelines and data APIs

What you get

  • Radio integration
  • Antenna guidance
  • Connectivity firmware
  • Cloud pipeline
06

Rapid Prototyping & Production Handoff

Prototypes are questions asked in copper and silicon. We run tight, instrumented iteration loops — every build produces data, every revision closes a risk — until the design is ready to leave our hands cleanly.

  • Board bring-up with documented, repeatable procedures
  • Instrumented validation: power, RF, thermal, mechanical fit
  • EVT / DVT / PVT planning and execution
  • Vendor coordination for fab, assembly, and test
  • Complete production packages a CM can run without us

What you get

  • Bring-up reports
  • Validation data
  • Production package
  • Vendor handoff

Engagement models

Three ways to work together.

01

Full product development

You bring the product vision; we carry it from requirements through production handoff. One contract, one accountable engineer, every discipline covered.

02

Design partnership

Your team owns the product; we take a defined slice — the PCB, the firmware, the RF section — and integrate tightly with your engineers and your process.

03

Advisory & design review

A second set of eyes before you commit to a board spin, an architecture audit before you scale, or AI-tooling strategy for your own engineering team.

Not sure which model fits?

Send over what you know — even a napkin sketch. We'll tell you honestly what we'd do, what it costs, and whether you need us at all.